EP21TDC-2AOLV Product Information

EP21TDC-2AOLV Two Part Epoxy Compound

Two Component, Highly Flexibilized, Thermally Conductive, Electrically Insulating Epoxy Resin Compound for High Performance Bonding, Sealing, Coating and Encapsulation.

Supreme 3HTLV Product Information

Supreme 3HTLV One Part Epoxy Adhesive System

One Component, No Mix, Toughened Epoxy for Bonding, Sealing and Coating Featuring Very Fast Curing, High Shear and Peel Strength Properties along with Superior Thermal Cycling Capabilities.

EP21TDCN-LO Product Information

EP21TDCN-LO Two Part Epoxy System

Two Component Nickel Conductive Epoxy Adhesive for High Performance Bonding Featuring High Peel Strength, Superior Toughness and Low Volume Resistivity

X5G Product Information

X5G One Part Elastomeric System

Thermally Conductive, Elastomer Based, One-Component Adhesive For High Performance Bonding and Sealing

X5N Product Information

X-5N One Part Elastomeric Compound

Thermally Conductive, Elastomer Based, One-Component Adhesive For High Performance Bonding and Sealing

X5SC Product Information

X5SC One Part Elastomeric System

Thermally Conductive, Elastomer Based, One-Component Adhesive For High Performance Bonding and Sealing

EP31ND Product Information

EP31ND Two Part Epoxy Adhesive

Two Component, Room Temperature Curing Epoxy Adhesive for Structural Bonding Featuring Extraordinarily High Shear & Peel Strengths

EP21TDCHTND Product Information

EP21TDCHTND Two Part Epoxy System

Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance.

EP46HT-2ND2 Product Information

EP46HT-2ND2 Two Part Epoxy Compound

Two Component, Heat Resistant, Epoxy System for High Performance Bonding, Sealing and Casting. Features a Glass Transition Temperature in Excess of 220°C; Requires Elevated Temperature Curing at 250°F or Above.

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