EP21TDCS Product Information

EP21TDCS Two Part Epoxy

Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity.

EP21TDCS-LO Product Information

EP21TDCS-LO Two Part Adhesive System

Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity. Passes ASTM 595 for NASA Low Outgassing

EP21TDCSFL Product Information

EP21TDCSFL Two Part Conductive Epoxy

Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring Convenient Handling, Exceptional Low Volume Resistivity and High Flexibility.

EP21TDCSMed Product Information

EP21TDCSMed Two Part Medical Grade Epoxy

High Performance, Two Component, Silver Conductive Epoxy Adhesive/Sealant Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity. Meets USP Class VI Specifications for Medical Applications

EP21TPFL-1 Product Information

EP21TPFL-1 Two Component Epoxy Polysulfide

Two Component, Low Viscosity Epoxy Polysulfide Compound for High Performance Bonding, Sealing, Coating and Casting with Outstanding Resistance to Fuels, Oils and Other Chemicals; Offers Exceptionally High Flexibility.

EP21TPFL-1AO Product Information

EP21TPFL-1AO Two Part Epoxy Polysuifide System

Two Part, Flexible, Lower Viscosity Epoxy Polysulfide System for High Performance Bonding, Sealing, Coating and Casting; Outstanding Resistance to Fuels and Oils with Superior Thermal Conductivity and Electrical Insulation Properties.

EP30FL Product Information

EP30FL Two Part Epoxy

Two Component, Room Temperature Curing Epoxy System for High Performance Potting, Casting, Bonding and Sealing Featuring Exceptionally Low Viscosity and Good Flexibility.

EP30FLAO Product Description

EP30FLAO Two Part Epoxy Compound

Two Component, Room Temperature Curing, Flexibilized, Thermally Conductive, Electrically Isolating Epoxy for Potting, Bonding, Sealing and Coating. Featuring Low Viscosity and Cryogenic Service Capability.

EP30FLSP Product Description

EP30FLSP Two Component Epoxy

Low Viscosity, Flexibilized, Two Component Epoxy Compound for High Performance Potting, Casting, Encapsulation, Bonding and Sealing. Contains UV Blocking Agent & Wetting Agent

EP31 Product Information

EP31 Two Component Epoxy System

Two Component, Room Temperature Curing Epoxy Adhesive for Structural Bonding Featuring Extraordinarily High Shear & Peel Strengths

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