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EP21LV Product Information | MasterBond.com

Two component, low viscosity epoxy compound

EP21LV Two Component Low Viscosity Epoxy System

Key Features

  • Suitable for bonding, sealing, coating, encapsulation and casting
  • Adjustable rigidity and flexibility by altering the mix ratio
  • Conforms to FDA Chapter 1, Section 175.105 for indirect food applications
  • Cures at room temperature
  • Serviceable from -65°F to +250°F
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