Expanded Product List
Master Bond Product Search
183 products match
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EP39MAOHT Thermally conductive, low viscosity potting/encapsulation compound. Superior dielectric properties. Versatile cure schedules. Convenient one to one mix ratio weight or volume. Minimal shrinkage and stress development. Resists thermal cycling and mechanical shocks. Service temperature range -100°F to +400°F. |
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EP3ANHT Heat resistant thermal conductive epoxy for potting and bonding. No mix system. 100% reactive. Thermal conductivity 23 BTU in/ft2/hr/°F. Gel time 90-100 seconds at 150°C. Volume resistivit <1015 ohm-cm. Offers protection against abrasion and thermal cycling. Serviceable from -60°F to +400°F. |
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EP3AOHT Light paste. One component, no mix system. Thermally conductive/electrically insulative. Service temperature range -60°F to +400°F. Flexible cure schedules. Cost effective. |
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EP3AOHTLV Single component thermally conductive/electrically insulative epoxy for bonding/potting. Heat resistant. Fast curing. Offers excellent adhesion to metallic and nonmetallic substrates. Serviceable from -60°F to +400°F. |
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EP3HTN Nickel filled electrically conductive epoxy adhesive has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Smooth paste, consistency. Dispensible from syringe applicator. Serviceable from -60°F to +400°F. |
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EP3HTS Silver filled electrically conductive epoxy adhesive has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Smooth paste, consistency. Dispensible from syringe applicator. Serviceable from -60°F to +400°F. |
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EP3HTS-LO High performance, one component silver filled electrically conductive adhesive. Low volume resistivity. Bonds wells to a wide range of substrates. Meets NASA low outgassing requirements. Thermally conductive. Rapid cures at moderate temperatures. Easy to dispense. Serviceable from -60°F to +400°F. |
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EP3HTS-TC Silver filled electrically conductive, for die attach and general bonding. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Thixotropic paste, consistency. Available in syringes that are compatible with various types of automatic dispensers or manual dispensing. Serviceable from -80°F to +400°F. |
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EP3HTSCN Silver coating nickel filled electrically conductive epoxy adhesive has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Smooth paste, consistency. Dispensible from syringe applicator. Serviceable from -60°F to +400°F. |
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EP3HTSDA-1 Silver filled electrically conductive, die attach epoxy has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Smooth paste, consistency. Available in syringes that are compatible with various types of automatic dispensers or manual dispensing. Serviceable from -80°F to +400°F. |