Master Bond Product Search

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EP30LTE-LO Two Part Epoxy Compound EP30LTE-LO

Two component epoxy system. Extra low thermal expansion coefficient and unmatched dimensional stability. Bonding, sealing, casting compound. Passes NASA low outgassing specifications. Room temperature curing. Low shrinkage. Serviceable from 4k to +250°F. Successfully tested for 1,000 hours 85°C/85% RH.

EP30LV Two Component Epoxy EP30LV

High performance general purpose adhesive, sealant, casting compound. Low viscosity. Optically clear. High bonding strength. Electrically insulative. Easy to apply. Allows for wicking and capillary action. Room temperature curing. Serviceable from -60°F to +250°F.

EP30LV-1 Two Part Epoxy System EP30LV-1

Ultra low viscosity epoxy system. Cures at room temperature. Outstanding optical clarity. Electrically insulative. High strength rigid bonds. Fills gaps in confined areas. Serviceable from -60°F to +250°F.

EP30M3LV-2NV

Epoxy-urethane blend. Superior toughness and abrasion resistance. Biocompatible. Cryogenically serviceable. Low viscosity. Low moisture absorption and hydrolytic stability. USP Class VI approved. Serviceable from 4k to +250°F. Outstanding electrical insulation properties. Withstands thermal cycling. High impact strength.

EP30M3LV Two Component Epoxy System EP30M3LV-NV

Low viscosity epoxy potting/casting compound. Superior electrical insulation properties. Long open time. Low exotherm. Contains special air release agents to prevent bubble formation. Shore D hardness 55-70. Excellent chemical resistance. Serviceable from -60°F to +250°F.

EP30M3LVR Two Part Epoxy EP30M3LVR

Potting/casting compound. Cures at ambient temperature. Good flowability. Special additives enhance release of air bubbles. 100% reactive. Superior electrical insulation properties. High physical strength. Chemical resistant. Serviceable from -60°F to +250°F.

EP30M4 Two Part Epoxy EP30M4

Potting compound offering low exotherm. Outstanding chemical resistance and electrical insulation properties. Protects against exposure to Skydrol, xylene, 70% sulfuric acid, 98% sulfuric acid, 50% sodium hydroxide and bleach. Cures at ambient temperatures or more quickly at elevated temperatures.
Moderate viscosity. Service operating temperature range from -80°F to +300°F. Withstands 1,000 hours 85°C/85% RH.

EP30M4LV Two Part Epoxy System EP30M4LV

Low viscosity epoxy compound for high performance bonding, sealing, casting and potting. Impressive chemical resistance to acids, bases, fuels oils, solvents and water. Low exotherm. Serviceable from -80°F to +250°F. Superior dielectric strength. Shore D hardness 75-85. Excellent adhesion to similar and dissimilar substrates.

EP30Med Two Part Epoxy EP30Med

Biocompatible two component epoxy. USP Class VI approved. Low viscosity. Versatile cure schedules. Resists EtO, gamma radiation and cold sterilants. High strength rigid bonds. Serviceable from -60°F to +250°F. Can be used for indirect food contact per 175.105 FDA specification.

EP30ND Two Part Epoxy EP30ND

Light paste. Spreads evenly and smoothly. Superior chemical resistance properties. Cures at room temperatures. Machinable. Service temperature range -60°F to +250°F. High bond strength

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