355 products match
EP21HV High performance two component adhesive, sealant, encapsulant. Good flow characteristics. Minimal shrinkage upon cure. Superior bond strength to similar and dissimilar substrates. One to one mix ratio weight or volume. Serviceable from -60°F to +250°F. |
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EP21LP Black Moderate viscosity. Allows the hardness to be altered by adjusting the mix ratio. Reliable electrical insulator. Dimensionally stable. High physical strength. Low shrinkage upon curing Serviceable from -60°F to +250°F. Black color. |
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EP21LP Gray Room temperature curing two component epoxy adhesive, sealant, coating, encapsulant. Varying mix ratio can adjust hardness of cure. Superior electrical insulation properties. Superb dimensional stability. Chemical resistant. Serviceable from -60°F to +250°F. Gray color. |
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EP21LP Two component clear epoxy system. One to one mix ratio by weight or volume. Flowable. High bond strength. Temperature range from -60°F to +250°F. Versatile cure schedule. Easy application. |
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EP21LSCL-2 Superb optical clarity. Non-yellowing properties. Two component low viscosity epoxy resin system. Long working life. Excellent electrical insulator. Used for large volume potting applications. Serviceable from -60°F to +350°F. |
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EP21LSCL-2Med Superb optical clarity. Non-yellowing properties. Two component low viscosity epoxy resin system. Long working life. Excellent electrical insulator. Passes ISO 10993-5. Serviceable from -60°F to +250°F. |
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EP21LV Epoxy adhesive, sealant, coating resists acids, alkalis and many solvents. Low viscosity room temperature curing. Contains no solvents. Serviceable from -60°F to +300°F. Castable to thicknesses exceeding 2-3 inches. Excellent electrical insulator. |
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EP21LV-1 Slightly toughened. High strength bonds. Cures readily at room temperature. Enhanced resistance to mechanical vibration and shock. Serviceable from -60°F to +250°F. Available premixed and frozen. |
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EP21LV-LO NASA low outgassing approved. High physical strength properties. Easy to mix and apply. Excellent chemical resistance. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +250°F. Ideal for potting and encapsulation. Vacuum compatible. |
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EP21LV3/5Med Low viscosity epoxy adhesive, sealant, coating and casting compound. USP Class VI approved. Resists vibration, impact, shock., thermal cycling. Ideally suited to bond dissimilar substrates. Serviceable from -80°F to +250°F. Withstand exposure to EtO, radiation and chemical sterilants. Excellent toughness. |