Expanded Product List
Master Bond Product Search
355 products match
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EP21DP11 Red Flexible two component epoxy for bonding, sealing, casting, potting. Low viscosity. 100% reactive. Resistant to thermal cycling. Superb electrical insulator. Serviceable from -60°F to +250°F. Contains release agent that facilitates use in potting and encapsulation application. Shore D hardness 45-55. Red color. |
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EP21DP12 Flexible two component epoxy for bonding, sealing, casting, potting. Urethane modified epoxy, 100% reactive. Resistant to thermal cycling. Serviceable from -100°F to +250°F. Available in many colors. |
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EP21FL Toughened, two component epoxy system for bonding, sealing and potting. Excellent resistance to impact and exposures to many chemicals. Superior electrical insulation properties. Low exotherm upon cure. Long working life. Serviceable from -100°F to +250°F. Withstands 1,000 hours 85°C/85% RH. |
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EP21FLV Fast curing epoxy adhesive. Produces durable, tough, high strength bonds. Will cure at low ambient temperatures. Resistant to thermal cycling. Non critical equal weight or volume mix ratio. Excellent dielectric properties. Service operating temperature range from -60°F to +250°F. |
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EP21FRNS-2 Durable potting, encapsulation, casting compound meets UV 94V-0 flame retardant specifications. Convenient one to one mix ratio by weight. Features a non-halogen filler. Superb flow properties. Outstanding electrical insulation. Low smoke generation. Serviceable from -51°C to +90°C. |
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EP21H Two component optically clear epoxy system. Special cross linking profile that allows for exceptional light transmission in the 250-365 nm spectra Long pot life. Low viscosity. Excellent physical strength properties. Serviceable from -60°F to +250°F. |
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EP21HT Two component adhesive, sealant and coating. High mechanical strength properties. Volume resistivity of 1014 ohm-cm. Dielectric constant of 2.90. One to one mix ratio. Tensile lap shear when bonding aluminum to aluminum of 3,200 psi at 75°F. Superior chemical resistance. Serviceable from -60°F to +400°F. Cures readily at ambient temperature or faster at elevated temperatures. Meets FDA 175.105 requirements for indirect food applications. |
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EP21HT-LO NASA low outgassing approved. Two component smooth flowing epoxy with convenient one to one mix ratio weight or volume. High bond strength. Excellent electrical insulation properties. Withstands 1,000 hours 85°C/85% RH. |
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EP21HTFG Two component room temperature curing epoxy adhesive, sealant, coating. Moderate viscosity. Forgiving one to one mix ratio weight or volume. Formidable bond strength. Can be used for indirect food contact applications as per FDA 175.105 specifications. Serviceable from -60°F to +400°F. |
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EP21HTND Room temperature curing two component non-drip paste adhesive. Serviceable from -60°F to +400°F. Impressive bond strength. Gap filler. Forgiving one to one mix ratio. Meets FDA Section 175.105 for indirect food contact. Shore D hardnes >75. |