Widely used for applications in the aerospace, electronic and OEM industries, Master Bond EP121CL-LO is a high performance epoxy that passes ASTM E595 testing for NASA low outgassing specifications. This two component system has a low mixed viscosity of 1,000-3,000 cps with a mix ratio of 100:80 by weight.
Formulated primarily for high performance structural bonding applications, Master Bond EP13SPND-2 is a one part, high temperature resistant epoxy for the aerospace and specialty OEM industries. As a single component system, this product is easy to handle and does not require mixing prior to use. It also has an unlimited working life at room temperature.
Specially formulated for medical device applications, Master Bond MasterSil 912Med is a room temperature vulcanizing silicone system for high performance bonding, sealing and coating. This system meets both USP biocompatibility and ISO cytotoxicity standards and resists a variety of sterilization techniques such as gamma radiation, EtO and some types of liquid sterilants.
Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m·K)]. As a polysulfide based system, it has very good chemical resistance, particularly to fuels, oils, hydraulic fluids and related compounds.
Combining simple handling properties with high strength, Master Bond Supreme 10HTF-1 is a single part adhesive/sealant for a variety of applications in the aerospace, electronic, optical, specialty OEM and related industries. At room temperature, this smooth paste system has an “unlimited” working life and cures rapidly at elevated temperatures.
Featuring special high thermal conductive fillers, Master Bond EP48TC is two part epoxy paste that can be applied in bond lines as thin as 10-15 microns. This material offers exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W, which imparts impressive heat transfer capabilities and thermal conductivity of 20-25 BTU•in/ft2•hr•°F [2.88-3.60 W/(m·K)].