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One Part, Silver Filled Epoxy for EMI/RFI Shielding |
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EP4S-80 cures at the low temperature of 80˚C |
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Master Bond EP4S-80 is a one component, silver filled epoxy for bonding, sealing and coating. This NASA low outgassing approved system cures at the low temperature of 80˚C and bonds well to a variety of substrates. Watch this video to see how this low viscosity compound can be dispensed through a syringe or brushed on to create a protective coating. |
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Copyright © 2022 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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