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| Thermally Conductive Adhesives & Coatings for Heat Dissipation |
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| Thermal management is a critical factor when dealing with electronic applications where excess heat is generated by tightly packed circuits and components. The need for adhesives and coatings with effective heat dissipation properties is crucial for the reliability and performance of these electronic devices. Learn more about our product line of specialty thermal conductive formulations for extreme service conditions.
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| Top Thermally Conductive Adhesive & Coating Systems |
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| EP3HTS-TC |
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| Fast curing, silver filled one part epoxy with very long open time |
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| EP3HTSDA-2 |
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| Silver filled conductive epoxy for die attach applications |
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| EP30NG |
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| Graphene filled epoxy with high compressive strength |
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| EP40TCMed |
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| Flowable epoxy with high bond strength for medical device assemblies |
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| EP5G-80 |
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| Graphite filled NASA low outgassing certified epoxy |
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| MasterSil 705TC |
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| One part, non-corrosive silicone with electrical insulation |
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This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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