Thermal Cycling Resistant

EP3UF-1 Product Information

EP3UF-1 One Component Epoxy

One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.

EP36FR Product Information

EP36FR One Component Epoxy

One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Encapsulation, Coating and Bonding Applications; Featuring Thermal Conductivity and Electrical Isolation. Available in 30 Gram Cookies.

Supreme 11AOHTLP Product Information

Supreme 11AOHTLP Two Part Epoxy

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Isolating Epoxy for Bonding and Sealing Featuring High Temperature Resistance along with High Shear and Peel Strength.

EP3HTSCN Product Information

EP3HTSCN One Part Epoxy

One Component, Heat Curing, Silver Filled, Electrically Conductive Epoxy Adhesive/Sealant Featuring High Shear Strength and Good Temperature Resistance Along With a Rapid Cure Speed.

EP3HTN Product Information

EP3HTN One Part Epoxy

One Component, Heat Curing, Silver Filled, Electrically Conductive Epoxy Adhesive/Sealant Featuring High Shear Strength and Good Temperature Resistance Along With a Rapid Cure Speed.

EP30DPSP Product Information

EP30DPSP Two Part Epoxy

Meets USP Class VI Specifications for Medical Applications Flexibilized, Two Component , Epoxy-Urethane Blend Used For Bonding, Coating, Sealing and Encapsulation, Featuring Superior Toughness, Repairability, Abrasion Resistance, and Cryogenic Serviceability

Supreme 3HTND-2DM Product Information

Supreme 3HTND-2DM One Component Epoxy

One Component, High Performance Epoxy System Featuring Fast Curing. Ideal for Glob Top Applications as well as Bonding and Sealing; Formulated to Withstand Thermal Cycling and Shock.

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