Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity. Passes ASTM 595 for NASA Low Outgassing
Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring Convenient Handling, Exceptional Low Volume Resistivity and High Flexibility.
High Performance, Two Component, Silver Conductive Epoxy Adhesive/Sealant Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity. Meets USP Class VI Specifications for Medical Applications
Two Component, Low Viscosity Epoxy Polysulfide Compound for High Performance Bonding, Sealing, Coating and Casting with Outstanding Resistance to Fuels, Oils and Other Chemicals; Offers Exceptionally High Flexibility.
Two Part, Flexible, Lower Viscosity Epoxy Polysulfide System for High Performance Bonding, Sealing, Coating and Casting; Outstanding Resistance to Fuels and Oils with Superior Thermal Conductivity and Electrical Insulation Properties.
Aluminum Filled, Tough, Two Component Epoxy Adhesive for High Performance Bonding, Sealing and Coating with Enhanced Machinability and First Class Dimensional Stability.
Flexibilized, Two Component, Room Temperature Curing, Urethane-Modified Epoxy System Featuring Superior Toughness, and Abrasion Resistance for High Performance Bonding, Sealing, Coating and Encapsulation
Two Component, Room Temperature Curing Epoxy System for High Performance Potting, Casting, Bonding and Sealing Featuring Exceptionally Low Viscosity and Good Flexibility.
Two Component, Room Temperature Curing, Flexibilized, Thermally Conductive, Electrically Isolating Epoxy for Potting, Bonding, Sealing and Coating. Featuring Low Viscosity and Cryogenic Service Capability.
