Low Outgassing

Supreme 3HTND-2DM-1 Product Information

One Part Epoxy Supreme 3HTND-2DM-1

One component epoxy featuring non drip consistency for bonding, sealing and specialty dam-and-fill encapsulation

UV10TK40 Product Information

One Component, Higher Viscosity UV Curable System for High Performance Bonding, Sealing and Coating, Featuring Excellent Physical Properties, Dimensional Stability and Chemical Resistance with an Outstanding Tg

Supreme 112 Product Information

Supreme 112: two part epoxy for bonding, sealing, potting and impregnation

Two part, heat curing epoxy for potting, encapsulation, coating, sealing and impregnation

Supreme 3CCM-85 Product Information

Supreme 3CCM-85 One Component Epoxy Compound

One Component, Toughened Epoxy System Cures at 175-185°F.

EP30NS Product Information

EP30NS Two Part Epoxy

Highly Versatile, Low Viscosity, Two Component Epoxy System for High Performance Bonding, Coating, Sealing and Casting; Featuring Superb Optical Clarity.

UV22DC80-10F Product Information

UV22DC80-10F One Part UV System

One Component, Nanosilica Filled UV Curable Epoxy System with Superb Optical Clarity, Abrasion Resistance and Dimensional Stability for Bonding, Sealing, Coating and Encapsulation. Exceptionally Low Shrinkage.

EP30LTE-2 Product Information

EP30LTE-2 Two Part Epoxy

Two Component, Low Viscosity, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Encapsulating Featuring Very Low Coefficient of Expansion, Excellent Dimensional Stability and Low Shrinkage Upon Cure.

EP114 Product Information

EP114 Two Component Epoxy

Two Component Nanosilica Reinforced Epoxy Resin System Featuring Outstanding Mechanical Properties, Excellent Electrical Insulation, Superior Abrasion Resistance & Hardness as well as Optical Clarity for Coating, Casting, Potting, Encapsulation & Sealing for Services from -100°F to 500°F!

EP13LTE Product Information

EP13LTE One Part Epoxy

One Component, Heat Curing Structural Adhesive Featuring High Tensile Shear Strength and High Temperature Resistance for Optimal Bonding Performance Up To 450°F.

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