UV22DC80-1Med Product Information

UV Dual Curing System UV22DC80-1Med

One Component, Nanosilica Filled UV Curable Epoxy System Meets ISO 10993-5 for Cytotoxicity

Supreme 3CCM-85 Product Information

Supreme 3CCM-85 One Component Epoxy Compound

One Component, Toughened Epoxy System Cures at 175-185°F.

Supreme 3HTS-80 Product Information

One component, silver conductive epoxy adhesive featuring high bond strength

One Component, Silver Conductive Epoxy Adhesive Featuring High Shear and High Peel Strengths. Uniquely Special System Cures between 175°F and 185°F with Physical Strength Properties and Excellent Conductivity.

UV10-FD Product Information

UV10-FD One Part UV System

One Component, Low Viscosity UV Curable System for High Performance Bonding, Sealing & Coating, Featuring Excellent Physical Properties and Dimensional Stability.

UV22DC80-10F Product Information

UV22DC80-10F One Part UV System

One Component, Nanosilica Filled UV Curable Epoxy System with Superb Optical Clarity, Abrasion Resistance and Dimensional Stability for Bonding, Sealing, Coating and Encapsulation. Exceptionally Low Shrinkage.

UV15-7NS Product Information

One component, nanosilica filled UV curable system

Supreme 3ANLV-1 Product Information

Supreme 3ANLV-1 One Part Epoxy

One Component, Heat Curing Epoxy Adhesive, Sealant Featuring Both High Shear and High Peel Strength for Optimal Bonding Performance and Exceptionally High Thermal Conductivity

UV15DC80ND Product Information

UV15DC80ND One Part UV System

One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.

EP3UF-1 Product Information

EP3UF-1 One Component Epoxy

One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.

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